I + D / Textiles inteligentes y soluciones TIC 

HYBRID  – THE DEVELOPMENT OF HYBRID ELECTRONIC SOLUTIONS ON A TEXTILE BACKING 

Year: 2020

MOTIVATION

In recent years, electronics have begun to evolve from their traditional rigid, rectangular shapes into more complex, slender forms adapted to where they are installed. In addition, flexible and even stretchable backings are now being used, making it possible to bend and stretch circuits to some extent. These new functionalities enable them to be better integrated into textile products, incorporating sensors, data processing and communication elements.

These new flexible solutions have undergone huge advances in recent years with the appearance of specific materials for each use including conductive, resistive, dielectric, electro luminescent or semiconductor inks. The complex overlapping of the structures of these materials, combined with specific designs and patterns enables the creation of tiny sensors and components for specific functions such as electrocardiogram (ECG) electrodes, electroencephalography (EEG) electrodes, pressure sensors, humidity sensors, temperature sensors and small circuits. Their applications are mainly concerned with energy, health and consumer electronics.

However, although flexible electronics manufacturing processes have advanced greatly, the level of integration and reductions in the size of circuitry is limited by the technologies employed. In this sense, traditional technologies such as silicon electronics, which have been with us for nearly 60 years, offer advantages. This technology allows high levels of integration, which in addition to reducing size, offers lower energy consumption while incorporating greater functionality.

Hybrid electronics combine the best of both worlds: on the one hand, flexibility and adaptability of the components and, on the other, processing power and minimum energy consumption. The HYBRID project aims to continue to advance our knowledge on the application of electronic inks with organic materials on flexible and stretchable substrates incorporating tiny silicon components.

OBJECTIVES

The objective of the project is to research and develop hybrid electronic solutions combining printed circuits and silicon integrated components for textile applications.

On the one hand, flexible electronic circuits will be designed and developed for screen-printing, inkjet and flexography including silicon components.

Different possibilities for incorporating both analogue and digital sensors will be studied. Different sizes of integrated footprint will be evaluated to facilitate installing devices on the circuitry.

Research will also be carried out on the development of conductive inks suitable for printing on textile substrates. To do so, they will have to meet minimum requirements of flexibility to ensure that a printed circuit will last throughout the lifetime of the textile.

EXPECTED RESULTS

The successful outcome of the project enhance our knowledge of the application of electronic inks in the development of different substrates with electrical properties and the use of the different additive technologies in hybrid electronics.

In addition, the work will result in the development of complete flexible circuits for sensorisation. These circuits can integrate easily into textile articles, to incorporate sensorisation functionalities.

Another important result will be the publication of articles in relevant scientific journals. Likewise, publication in the popular technology digital media (blogs, web pages and newsletters) to increase the impact of the results obtained.

This project is funded by the Conselleria d’Economia Sostenible, Sectors Productius, Comerç i Treball de la Generalitat Valenciana, through IVACE.

GRANT NUMBER: IMAMCI/2020/1
MORE INFORMATION IN THE NON-ECONOMIC ACTIVITIES PLAN

Additional Information

• Year: 2020

• Status: Finished

• Entity: IVACE

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